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TFM322512ALVA3R3MTAA - TDK

Description: Fixed Inductors 40VDC 3.3uH 20% 2.5A 113mOhm AEC-Q200

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PCB Footprints
TFM322512ALVA3R3MTAA - TDK PCB footprint - Inductors Chip - Inductors Chip - TFM3225_2021-3
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3D Models
TFM322512ALVA3R3MTAA - TDK  - 3D model - Inductors Chip - TFM3225_2021-3
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TFM322512ALVA3R3MTAA Details

  • Manufacturer Part Number:

    TFM322512ALVA3R3MTAA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    1210

  • Construction:

    Rectangular

  • Core Material:

    Metal

  • DC Resistance:

    0.113 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.2 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    2.3 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

TFM322512ALVA3R3MTAA Frequently Asked Questions (FAQs)

  • The recommended land pattern for TFM322512ALVA3R3MTAA can be found in the TDK Corporation's application note or footprint recommendation document, which provides detailed information on the recommended pad layout, size, and spacing for optimal performance and reliability.
  • Thermal management of TFM322512ALVA3R3MTAA is critical to ensure reliable operation. It is recommended to use a thermal pad or heat sink to dissipate heat, and to follow the thermal design guidelines provided in the datasheet or application note. Additionally, the PCB design should ensure good thermal conductivity and airflow to prevent overheating.
  • The maximum operating temperature range for TFM322512ALVA3R3MTAA is typically specified in the datasheet, but it's essential to note that the device may have different temperature ratings for storage, operation, and reflow soldering. It's crucial to check the datasheet and follow the recommended temperature guidelines to ensure reliable operation and prevent damage.
  • To ensure the reliability of TFM322512ALVA3R3MTAA in high-vibration or harsh environments, it's recommended to follow the recommended mounting and soldering guidelines, use a secure and reliable attachment method, and consider using additional mechanical support or strain relief. Additionally, the PCB design should be optimized for vibration and shock resistance, and the device should be tested and validated for the specific application environment.
  • ESD protection and handling are critical for TFM322512ALVA3R3MTAA to prevent damage during handling, storage, and assembly. It's recommended to follow the ESD handling guidelines provided in the datasheet or application note, use ESD-protective packaging and materials, and ensure that the assembly process is ESD-controlled.

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TFM322512ALVA3R3MTAA Overview

Use the download button to access the TFM322512ALVA3R3MTAA schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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Part Image TFM322512ALMA3R3MTAA TDK Corporation

General Purpose Inductor, 3.3uH, 20%, 1 Element, Metal-Core, SMD, 1210