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TFP410PAPG4 - Texas Instruments

Description: Digital Transmitter 3TX 64-Pin HTQFP EP Tray

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PCB Footprints
TFP410PAPG4 - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PAP (S-PQFP-G64)
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3D Models
TFP410PAPG4 - Texas Instruments  - 3D model - Quad Flat Packages - PAP (S-PQFP-G64)
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TFP410PAPG4 Details

  • Manufacturer Part Number:

    TFP410PAPG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    64

  • Country Of Origin:

    Taiwan

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Input Mode:

    SERIAL/PARALLEL

  • Display Mode:

    DOT MATRIX

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e4

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    3

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Equivalence Code:

    TQFP64,.47SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    250 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

  • fmax-Min:

    165 MHz

TFP410PAPG4 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TFP410PAPG4 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the device close to the power source. Additionally, using a common-mode choke and shielding can help reduce EMI.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V or 5V power supply, and decouple it with a 0.1uF capacitor to ground. Also, ensure the input voltage is within the recommended range of 0.5V to 3.5V.
  • The TFP410PAPG4 can support data rates up to 1.65 Gbps, making it suitable for high-speed applications such as HDMI and DisplayPort.
  • To manage thermal issues, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pad on the bottom of the package. Also, keep the device within the recommended operating temperature range of -40°C to 85°C.
  • The TFP410PAPG4 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and avoid touching the device's pins or exposed internal components.

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TFP410PAPG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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