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TFPT0805L5001FV - Vishay

Description: Vishay 0805 Thermistor Chips

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TFPT0805L5001FV - Vishay - PCB symbol
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PCB Footprints
TFPT0805L5001FV - Vishay PCB footprint - Thermistors Chip - Thermistors Chip - TFPT0805
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3D Models
TFPT0805L5001FV - Vishay - 3D model - Thermistors Chip - TFPT0805
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TFPT0805L5001FV Details

  • Manufacturer Part Number:

    TFPT0805L5001FV

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.40.80.70

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    8

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, CUL, UL

  • Resistance:

    5000 Ω

  • Resistor Type:

    PTC THERMISTOR

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Thermistor Application:

    TEMPERATURE COMPENSATION

  • Tolerance:

    1%

  • Working Voltage:

    40 V

TFPT0805L5001FV Frequently Asked Questions (FAQs)

  • The recommended land pattern for TFPT0805L5001FV is a rectangular pad with a size of 1.5 mm x 3.5 mm, with a non-solder mask defined (NSMD) pad shape.
  • Yes, TFPT0805L5001FV is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the component's performance and reliability may degrade at extreme temperatures.
  • Handle TFPT0805L5001FV by the edges to prevent damage to the component's internal structure. Avoid touching the component's pads or body to prevent electrostatic discharge (ESD) damage.
  • The recommended soldering profile for TFPT0805L5001FV is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be completed within 3-5 minutes.
  • Yes, TFPT0805L5001FV is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5.

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TFPT0805L5001FV Overview

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