Qorvo provides a recommended PCB layout and thermal management guide in their application note AN-1234. It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and to prevent overheating.
Qorvo offers a free online tool, the Qorvo GaN Device Model, which helps designers optimize the biasing and matching network for their specific application. Additionally, Qorvo's application engineers can provide custom support and guidance.
Qorvo provides a test and measurement guide in their application note AN-1235, which outlines the recommended procedures for characterizing the TGA2623-CP. This includes setup, calibration, and measurement techniques to ensure accurate and reliable results.
Qorvo recommends following the guidelines outlined in their application note AN-1236, which provides design considerations and best practices for ensuring EMC and reducing EMI in designs using the TGA2623-CP.
Qorvo performs a range of reliability and qualification tests on the TGA2623-CP, including temperature cycling, humidity testing, and electrical overstress testing. These tests ensure the device meets the required standards for reliability and performance.
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TGA2623-CP Overview
Use the download button to access the TGA2623-CP 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About Qorvo
Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.
