3 X 3 MM, 1.35 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC PACKAGE-16
ECCN Code:
EAR99
HTS Code:
8542.39.00.90
Manufacturer:
Qorvo
YTEOL:
3
Adjustability:
FIXED
Characteristic Impedance:
50 Ω
Construction:
COMPONENT
Input Power-Max (CW):
37 dBm
JESD-609 Code:
e4
Mounting Feature:
SURFACE MOUNT
Number of Terminals:
16
Operating Frequency-Max:
12000 MHz
Operating Frequency-Min:
2000 MHz
Output Power-Max:
18 dBm
Package Body Material:
PLASTIC/EPOXY
Package Equivalence Code:
LCC16,.12SQ,20
RF/Microwave Device Type:
LIMITER
Surface Mount:
YES
Terminal Finish:
Gold (Au) - with Nickel (Ni) barrier
VSWR-Max:
1.67
TGL2201-SM Frequently Asked Questions (FAQs)
A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure good thermal conductivity by using a thermal pad and connecting it to a heat sink or a metal plate.
Use a combination of simulation tools and empirical methods to optimize the input and output matching networks. Consider using a load-pull analysis to determine the optimal impedance for maximum gain and efficiency.
Operate the device within the recommended temperature range (-40°C to 85°C) and ensure a maximum junction temperature of 150°C. Avoid exceeding the maximum ratings for voltage, current, and power dissipation.
Use proper shielding, grounding, and filtering techniques to minimize EMI. Ensure that the device is placed in a shielded enclosure and that all cables and connectors are properly filtered and shielded.
Use a vector network analyzer (VNA) to measure S-parameters and a spectrum analyzer to measure output power and spectral purity. Ensure that the test setup is calibrated and that the device is properly terminated.
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TGL2201-SM Overview
Use the download button to access the TGL2201-SM 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About Qorvo
Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.
