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THC63LVD1023B - THine

Description: IC SERIALIZER DUAL LVDS 144LQFP

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PCB Footprints
THC63LVD1023B - THine PCB footprint - Quad Flat Packages - Quad Flat Packages - 144-LQFP (20x20)
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3D Models
THC63LVD1023B - THine  - 3D model - Quad Flat Packages - 144-LQFP (20x20)
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THC63LVD1023B Details

  • Manufacturer Part Number:

    THC63LVD1023B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    LQFP-144

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    THine Electronics Inc

  • Differential Output:

    YES

  • Driver Number of Bits:

    10

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    S-PQFP-G144

  • Length:

    20 mm

  • Number of Functions:

    10

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -20 °C

  • Out Swing-Min:

    0.1 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Current-Max:

    329 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Width:

    20 mm

THC63LVD1023B Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and crosstalk.
  • Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Also, consider using a thermal interface material to improve heat transfer.
  • The THC63LVD1023B can drive up to 100 pF of capacitance load. Exceeding this limit may cause instability or oscillation.
  • Check the PCB layout for noise and crosstalk issues, ensure proper power supply decoupling, and verify that the input voltage is within the recommended range. Also, check for any signs of overheating or physical damage.
  • Yes, the THC63LVD1023B can be used in battery-powered devices. To minimize power consumption, use a low-dropout regulator, enable the power-saving mode, and optimize the system's power management strategy.

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THC63LVD1023B Overview

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