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THC63LVD103D - THine

Description: 160MHz 30bit COLOR LVDS TRANSMITTER, 1.2V to 3.3V, 0C to +70C, 64pin TQFP

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PCB Footprints
THC63LVD103D - THine PCB footprint - Quad Flat Packages - Quad Flat Packages - 64pin TQFP
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3D Models
THC63LVD103D - THine  - 3D model - Quad Flat Packages - 64pin TQFP
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THC63LVD103D Details

  • Manufacturer Part Number:

    THC63LVD103D

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Part Package Code:

    QFP

  • Package Description:

    ROHS COMPLIANT, TQFP-64

  • Pin Count:

    64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    THine Electronics Inc

  • Differential Output:

    YES

  • Driver Number of Bits:

    30

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    S-PQFP-G64

  • Length:

    10 mm

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP64,.47SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    104 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    10 mm

THC63LVD103D Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The input and output capacitors should be placed close to the device, and the PCB traces should be as short as possible to minimize inductance.
  • The device requires a soft-start power-on sequence to prevent inrush currents. A recommended power-on sequence is to first apply VCC, then VDD, and finally the input voltage. For power-off, the sequence should be reversed.
  • The maximum allowed capacitance for the input capacitor is 10uF, and for the output capacitor is 22uF. Exceeding these values may affect the device's stability and performance.
  • The device has a thermal pad on the bottom side, which should be connected to a thermal plane on the PCB. A heat sink or thermal interface material can be used to improve heat dissipation. The maximum junction temperature is 125°C.
  • The recommended input voltage range is 2.5V to 5.5V. Operating the device outside of this range may affect its performance and reliability.

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