THGAMRG8T13BAIL - KIOXIA Corporation

THGAMRG8T13BAIL Details

• Manufacturer Part Number:

  THGAMRG8T13BAIL

• Part Life Cycle Code:

  Obsolete

• Package Description:

  WFBGA-153

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Manufacturer:

  KIOXIA

• YTEOL:

  0

• JESD-30 Code:

  R-PBGA-B153

• Length:

  13 mm

• Memory Density:

  274877906944 bit

• Memory IC Type:

  eMMC

• Memory Width:

  8

• Number of Functions:

  1

• Number of Terminals:

  153

• Number of Words:

  34359738368 words

• Number of Words Code:

  32000000000

• Operating Mode:

  ASYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -25 °C

• Organization:

  32GX8

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA153,14X14,20

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY

• Seated Height-Max:

  0.8 mm

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2.7 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  OTHER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Type:

  NAND TYPE

• Width:

  11 mm