- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for THGBM5G6A2JBAIR
- Part Number THGBM5G6A2JBAIR
- Manufacturer Toshiba
- Pin Count 153
- Part Category Integrated Circuit
- Package Category BGA
- Footprint Name BGA - P-VFBGA153
- Released Date Jan 17, 2022
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
THGBM5G6A2JBAIR Details
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Manufacturer Part Number:
THGBM5G6A2JBAIR
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Package Description:
VFBGA-153
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HTS Code:
8542.31.00.30
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Manufacturer:
Toshiba America Electronic Components
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YTEOL:
0
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JESD-30 Code:
R-PBGA-B153
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Length:
13 mm
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Number of Terminals:
153
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Operating Temperature-Max:
85 °C
THGBM5G6A2JBAIR Frequently Asked Questions (FAQs)
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A 4-layer PCB with a dedicated thermal plane and vias connecting to the thermal pad is recommended for optimal thermal performance.
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Ensure proper thermal management, follow the recommended PCB layout, and consider using a thermal interface material (TIM) to minimize thermal resistance.
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Operating at the maximum junction temperature may reduce the device's lifespan and affect its overall reliability. It's recommended to operate within the recommended temperature range for optimal performance and longevity.
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While the THGBM5G6A2JBAIR is a high-performance device, it may not meet the specific requirements for high-reliability or aerospace applications. Consult with Toshiba or a qualified representative to determine suitability for such applications.
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Follow standard ESD protection procedures, such as using ESD-safe materials, grounding straps, and ionizers to minimize the risk of electrostatic discharge damage.
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THGBM5G6A2JBAIR Overview
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