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THJB336M006RJN - Kyocera AVX

Description: Tantalum Capacitor , 1210 33µF 6.3V

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THJB336M006RJN - Kyocera AVX PCB footprint - Other - Other - CAPCP3528X210N
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THJB336M006RJN Details

  • Manufacturer Part Number:

    THJB336M006RJN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.50

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    Kyocera AVX Components

  • YTEOL:

    12

  • Additional Feature:

    ESR AND RIPPLE CURRENT IS MEASURED AT 100KHZ

  • Capacitance:

    33 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Dielectric Material:

    TANTALUM (DRY/SOLID)

  • ESR:

    2200 mΩ

  • Height:

    1.9 mm

  • JESD-609 Code:

    e3

  • Leakage Current:

    0.0021 mA

  • Length:

    3.5 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, 7 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    6.3 V

  • Reference Standard:

    AEC-Q200

  • Ripple Current:

    39 mA

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Tan Delta:

    0.06

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    J BEND

  • Width:

    2.8 mm

THJB336M006RJN Frequently Asked Questions (FAQs)

  • The recommended land pattern for THJB336M006RJN can be found in the Kyocera AVX Components' recommended land pattern document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • To handle THJB336M006RJN during assembly and rework, follow the standard industry practices for handling surface-mount devices (SMDs). Use anti-static wrist straps, mats, and packaging materials to prevent electrostatic discharge (ESD) damage. Avoid touching the component's leads or body, and use a vacuum pickup or tweezers to handle the component. For rework, use a hot air rework station or a soldering iron with a low-temperature profile to avoid damaging the component.
  • The thermal management strategy for THJB336M006RJN involves providing a thermal path from the component to a heat sink or a metal core printed circuit board (PCB). Use thermal interface materials (TIMs) such as thermal tape or thermal grease to fill the gap between the component and the heat sink or metal core PCB. Ensure that the heat sink or metal core PCB is designed to dissipate the heat generated by the component, and that the system is designed to operate within the component's specified temperature range.
  • Yes, THJB336M006RJN is designed to operate in high-vibration environments. However, it's essential to ensure that the component is properly mounted and secured to the PCB using a suitable adhesive or mechanical fastening method. Additionally, the PCB should be designed to withstand the vibration and shock loads, and the system should be tested to ensure that it meets the required reliability and performance standards.
  • To troubleshoot issues with THJB336M006RJN, follow a systematic approach to identify the root cause of the problem. Check the component's datasheet and application notes for guidance on troubleshooting common issues. Use diagnostic tools such as oscilloscopes, signal generators, and multimeters to measure the component's electrical characteristics and identify any anomalies. Consult with Kyocera AVX Components' customer support or a qualified engineer if the issue persists.

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THJB336M006RJN Overview

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About Kyocera AVX

Kyocera AVX is a global leader in the design, manufacture, and supply of electronic components, including capacitors, resistors, filters, connectors, and advanced ceramic products. The company was formed as a result of Kyocera Corporation's acquisition of AVX Corporation, combining Kyocera's expertise in ceramic technologies with AVX's strength in passive electronic components. This merger has allowed Kyocera AVX to offer a broad and diversified product portfolio, serving various industries.

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Part Image THJB336M006BJN Kyocera AVX Components

Tantalum Capacitor, Polarized, Tantalum (dry/solid), 6.3V, 20% +Tol, 20% -Tol, 33uF, Surface Mount, 1411, CHIP

Part Image THJB336M006KJN Kyocera AVX Components

Tantalum Capacitor, Polarized, Tantalum (dry/solid), 6.3V, 20% +Tol, 20% -Tol, 33uF, Surface Mount, 1411, CHIP