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THS3001HVIDGN - Texas Instruments

Description: General Purpose Amplifiers Current Feedback 1 9V ~ 37V, ±4.5V ~ 18.5V 1.75GHz 6500 V/us MSOP-8 RoHS

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THS3001HVIDGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN (S-PDSO-G8)(1)
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THS3001HVIDGN - Texas Instruments  - 3D model - Small Outline Packages - DGN (S-PDSO-G8)(1)
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THS3001HVIDGN Details

  • Manufacturer Part Number:

    THS3001HVIDGN

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Package Description:

    HVSSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    15 µA

  • Bandwidth (3dB)-Nom:

    350 MHz

  • Bias Current-Max (IIB) @25C:

    10 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    73 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -18.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.07 mm

  • Slew Rate-Nom:

    6500 V/us

  • Supply Current-Max:

    9 mA

  • Supply Voltage Limit-Max:

    18.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD SILVER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    420000

  • Wideband:

    YES

  • Width:

    3 mm

THS3001HVIDGN Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS3001HVIDGN involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • The gain resistor values for the THS3001HVIDGN depend on the desired gain and bandwidth of the amplifier. A good starting point is to use the recommended values in the datasheet, and then adjust them based on the specific requirements of your application. It's also important to consider the parasitic capacitance and inductance of the resistors when selecting their values.
  • The maximum power dissipation of the THS3001HVIDGN is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated based on the actual operating conditions.
  • To filter out noise and interference in your application, you can use a combination of passive and active filtering techniques. For example, you can use a low-pass filter at the input of the THS3001HVIDGN to remove high-frequency noise, and then use a shielding enclosure to reduce electromagnetic interference.
  • The recommended input impedance for the THS3001HVIDGN is 50 ohms, and the recommended output impedance is also 50 ohms. However, the actual impedance values may vary depending on the specific application and the desired signal integrity.

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THS3001HVIDGN Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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