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THS3001IDG4 - Texas Instruments

Description: High Speed Operational Amplifiers 420-MHz Curr Feedback Amp

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THS3001IDG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A  SOIC
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THS3001IDG4 - Texas Instruments  - 3D model - Small Outline Packages - D0008A  SOIC
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THS3001IDG4 Details

  • Manufacturer Part Number:

    THS3001IDG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, MS-012AA, SOIC-8

  • Pin Count:

    8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    15 µA

  • Bandwidth (3dB)-Nom:

    350 MHz

  • Bias Current-Max (IIB) @25C:

    10 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    73 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    6500 V/us

  • Supply Current-Max:

    9 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    420000

  • Wideband:

    YES

  • Width:

    3.9 mm

THS3001IDG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the THS3001 evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The input termination depends on the specific application and signal source. TI recommends using a 50-ohm termination for most applications, but a 75-ohm termination may be required for certain video applications. Consult the datasheet and application notes for more information.
  • The THS3001IDG4 is rated for operation from -40°C to 125°C, but the device's performance may degrade at extreme temperatures. Consult the datasheet for more information on temperature-related specifications.
  • Yes, the THS3001IDG4 can be used in a non-inverting configuration, but it requires a different pinout and component values. Consult the datasheet and application notes for more information on non-inverting configurations.
  • To reduce power consumption, consider using a lower supply voltage, reducing the output load, and optimizing the input signal amplitude. Additionally, TI provides power-saving modes and shutdown features that can be used to minimize power consumption when the device is not in use.

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THS3001IDG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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