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THS3062DGN - Texas Instruments

Description: Dual, High-Voltage, High Slew-Rate Current Feedback Amplifier

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THS3062DGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN (S-PDSO-G8)(1)
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THS3062DGN - Texas Instruments  - 3D model - Small Outline Packages - DGN (S-PDSO-G8)(1)
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THS3062DGN Details

  • Manufacturer Part Number:

    THS3062DGN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    25 µA

  • Bandwidth (3dB)-Nom:

    210 MHz

  • Bias Current-Max (IIB) @25C:

    25 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    72 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3500 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    7000 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    20 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    300000

  • Wideband:

    YES

  • Width:

    3 mm

THS3062DGN Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS3062DGN involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • The choice of gain resistors depends on the desired gain and bandwidth of the amplifier. A higher gain resistor value will result in higher gain but may compromise bandwidth. TI provides a gain resistor calculator tool to help with the selection.
  • The maximum power dissipation of the THS3062DGN is 1.4W. However, this can be affected by the ambient temperature, PCB layout, and thermal management. It's essential to ensure proper thermal design to prevent overheating.
  • Yes, the THS3062DGN can be used as a single-ended amplifier by tying the negative input to ground and using the positive input as the signal input. However, this will affect the noise performance and common-mode rejection ratio.
  • The THS3062DGN has a built-in low-pass filter, but additional filtering may be required depending on the application. External filters such as RC filters or ferrite beads can be used to filter out high-frequency noise.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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