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THS3095DDAG4 - Texas Instruments

Description: High Speed Operational Amplifiers Single Lo-Distort Current Feedback

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THS3095DDAG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DDA (R-PDSO-G8)+
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THS3095DDAG4 - Texas Instruments  - 3D model - Small Outline Packages - DDA (R-PDSO-G8)+
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THS3095DDAG4 Details

  • Manufacturer Part Number:

    THS3095DDAG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    25 µA

  • Bias Current-Max (IIB) @25C:

    15 µA

  • Common-mode Reject Ratio-Min:

    59 dB

  • Common-mode Reject Ratio-Nom:

    78 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.68 mm

  • Slew Rate-Nom:

    6000 V/us

  • Supply Current-Max:

    11 mA

  • Supply Voltage Limit-Max:

    33 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    715000

  • Wideband:

    YES

  • Width:

    3.9 mm

THS3095DDAG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the THS3095DDAG4 evaluation module (EVM) documentation, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The selection of input and output capacitors depends on the specific application requirements, such as frequency response, impedance, and ripple rejection. TI recommends using low-ESR capacitors with a value of 10uF to 22uF for input and output capacitors, and provides guidance on capacitor selection in the datasheet and application notes.
  • The maximum power dissipation of THS3095DDAG4 is dependent on the operating conditions, such as input voltage, output current, and ambient temperature. To ensure the device doesn't overheat, TI recommends following the thermal management guidelines in the datasheet, including using a heat sink, optimizing PCB layout, and providing adequate airflow.
  • TI provides troubleshooting guidelines in the datasheet and application notes, including checking for proper PCB layout, component selection, and input/output impedance matching. Additionally, engineers can use simulation tools, such as SPICE models, to analyze and debug their designs.
  • Yes, THS3095DDAG4 is compatible with lead-free soldering processes, and TI provides guidance on lead-free soldering in the datasheet and packaging documentation.

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THS3095DDAG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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