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THS3111CD - Texas Instruments

Description: Single, Low Noise, High Voltage Current-Feedback Amplifier

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THS3111CD - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - (D0008A-H=1.75
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THS3111CD - Texas Instruments  - 3D model - Small Outline Packages - (D0008A-H=1.75
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THS3111CD Details

  • Manufacturer Part Number:

    THS3111CD

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    4 µA

  • Bandwidth (3dB)-Nom:

    100 MHz

  • Bias Current-Max (IIB) @25C:

    4 µA

  • Common-mode Reject Ratio-Min:

    62 dB

  • Common-mode Reject Ratio-Nom:

    68 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    15 µA

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    900 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    6.5 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    100000

  • Wideband:

    YES

  • Width:

    3.9 mm

THS3111CD Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the THS3111CD evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The choice of input and output termination resistors depends on the specific application and signal requirements. TI provides guidelines for selecting termination resistors in the THS3111CD datasheet and application notes, including considerations for impedance matching, signal attenuation, and noise reduction.
  • The THS3111CD is specified to operate from -40°C to 125°C, but it's essential to consider the device's thermal characteristics, such as junction temperature and thermal resistance, to ensure reliable operation in extreme temperature environments.
  • To ensure EMC, follow proper PCB design and layout practices, such as using shielding, grounding, and filtering, and consider the device's electromagnetic radiation and susceptibility characteristics, as outlined in the THS3111CD datasheet and TI's EMC guidelines.
  • TI recommends using low-ESR, high-frequency decoupling capacitors, such as 100nF or 220nF ceramic capacitors, placed close to the device's power pins to minimize noise and ensure stable operation.

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THS3111CD Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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