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THS3112IDDAR - Texas Instruments

Description: Dual, Low-Noise, High Output Current, 110-MHz Amplifier

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THS3112IDDAR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DDA0008B_2021
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THS3112IDDAR - Texas Instruments  - 3D model - Small Outline Packages - DDA0008B_2021
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THS3112IDDAR Details

  • Manufacturer Part Number:

    THS3112IDDAR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    30 µA

  • Bandwidth (3dB)-Nom:

    103 MHz

  • Bias Current-Max (IIB) @25C:

    2 µA

  • Common-mode Reject Ratio-Min:

    63 dB

  • Common-mode Reject Ratio-Nom:

    67 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    22 µA

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.68 mm

  • Slew Rate-Nom:

    1550 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    13 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    110000

  • Wideband:

    YES

  • Width:

    3.9 mm

THS3112IDDAR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the THS3112 evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The THS3112's input impedance can be optimized by selecting the appropriate input termination resistors (RIN) and capacitors (CIN) based on the input signal frequency and amplitude. TI provides a calculator tool to help with this optimization.
  • The maximum power dissipation of the THS3112 is 1.4W. To ensure it doesn't overheat, the device should be mounted on a PCB with a thermal pad connected to a ground plane, and the ambient temperature should be kept below 85°C. Additionally, the device's power consumption can be reduced by optimizing the supply voltage and output load.
  • Yes, the THS3112 can be used with a single-ended input signal by connecting the negative input (IN-) to a fixed voltage reference, such as ground or a voltage divider. However, this will reduce the common-mode rejection ratio (CMRR) and may affect the overall performance.
  • The THS3112's output signal can be filtered using an external low-pass filter (LPF) or a band-pass filter (BPF) to remove high-frequency noise and aliasing. The filter design should be based on the specific application requirements and the THS3112's output frequency response.

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THS3112IDDAR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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