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THS3120CDGN - Texas Instruments

Description: Single, Low Noise, High Output Drive, 475mA Current-Feedback Amplifier with Power-down

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THS3120CDGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D
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THS3120CDGN - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D
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THS3120CDGN Details

  • Manufacturer Part Number:

    THS3120CDGN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    4 µA

  • Bandwidth (3dB)-Nom:

    66 MHz

  • Bias Current-Max (IIB) @25C:

    4 µA

  • Common-mode Reject Ratio-Min:

    63 dB

  • Common-mode Reject Ratio-Nom:

    70 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    15 µA

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1500 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    4.25 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    130000

  • Wideband:

    YES

  • Width:

    3 mm

THS3120CDGN Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the THS3120CDGN evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The choice of input and output termination resistors depends on the specific application and signal requirements. TI provides guidelines for selecting termination resistors in the THS3120CDGN datasheet and application notes, including considerations for impedance matching, signal integrity, and power consumption.
  • The THS3120CDGN is specified to operate from -40°C to 125°C, but it's essential to consider the derating of the device's performance and reliability at extreme temperatures. Consult the datasheet and TI's reliability documentation for more information.
  • Yes, the THS3120CDGN is suitable for high-reliability and aerospace applications. TI provides additional documentation and support for these applications, including radiation-hardened and high-reliability versions of the device. Contact TI's sales team or application engineers for more information.
  • TI provides troubleshooting guides and application notes that cover common issues and their solutions. Additionally, TI's support team and online forums can provide valuable resources and expertise to help resolve issues with the THS3120CDGN.

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THS3120CDGN Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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