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THS3201DGN - Texas Instruments

Description: Texas Instruments THS3201DGN Current Feedback Op Amp, 12 V, 9 V, 8-Pin MSOP

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THS3201DGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN (S-PDSO-G8)(1)
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THS3201DGN - Texas Instruments  - 3D model - Small Outline Packages - DGN (S-PDSO-G8)(1)
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THS3201DGN Details

  • Manufacturer Part Number:

    THS3201DGN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    3.9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Bias Current-Max (IIB) @25C:

    35 µA

  • Common-mode Reject Ratio-Min:

    58 dB

  • Common-mode Reject Ratio-Nom:

    71 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8.25 V

  • Neg Supply Voltage-Nom (Vsup):

    -7.5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    6700 V/us

  • Supply Current-Max:

    21 mA

  • Supply Voltage Limit-Max:

    8.25 V

  • Supply Voltage-Nom (Vsup):

    7.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1800000

  • Wideband:

    YES

  • Width:

    3 mm

THS3201DGN Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS3201DGN involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The gain resistor values for the THS3201DGN depend on the desired gain and bandwidth of the amplifier. A good starting point is to use the gain resistor calculator tool provided by Texas Instruments or to consult the application notes and design guides provided by TI.
  • The maximum power dissipation of the THS3201DGN is 1.4W. To ensure it doesn't overheat, make sure to provide adequate heat sinking, use a thermally conductive PCB material, and keep the device away from other heat sources. Additionally, ensure that the device is operated within the recommended operating conditions and that the power supply voltage is within the specified range.
  • Yes, the THS3201DGN can be used as a single-ended amplifier. To do so, connect the non-inverting input to the signal source, and tie the inverting input to ground through a resistor. The gain will be determined by the ratio of the feedback resistor to the gain resistor. Consult the datasheet and application notes for more information.
  • To filter out high-frequency noise and EMI, use a combination of passive components such as capacitors, inductors, and resistors to create a low-pass filter. Additionally, use shielding and grounding techniques to minimize electromagnetic radiation and susceptibility. Consult the datasheet and application notes for more information.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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