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THS3201MDGNREP - Texas Instruments

Description: High Speed Operational Amplifiers Mil Enhance 1.8GHz Feedback Amp

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THS3201MDGNREP - Texas Instruments - PCB symbol
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THS3201MDGNREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008G
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THS3201MDGNREP - Texas Instruments - 3D model - Small Outline Packages - DGN0008G
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THS3201MDGNREP Details

  • Manufacturer Part Number:

    THS3201MDGNREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    3.9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Bias Current-Max (IIB) @25C:

    35 µA

  • Common-mode Reject Ratio-Min:

    58 dB

  • Common-mode Reject Ratio-Nom:

    71 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8.25 V

  • Neg Supply Voltage-Nom (Vsup):

    -7.5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    6700 V/us

  • Supply Current-Max:

    22 mA

  • Supply Voltage Limit-Max:

    8.25 V

  • Supply Voltage-Nom (Vsup):

    7.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1800000

  • Wideband:

    YES

  • Width:

    3 mm

THS3201MDGNREP Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the THS3201 evaluation module documentation, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The selection of input and output termination resistors depends on the specific application and signal requirements. TI provides a termination resistor calculator tool to help designers select the optimal resistors for their design. Additionally, the THS3201 datasheet provides general guidelines for termination resistor selection.
  • The THS3201MDGNREP is rated for operation from -40°C to 125°C, but the device's performance may degrade at extreme temperatures. It's essential to consider the operating temperature range and thermal management in the system design to ensure reliable operation.
  • To ensure EMC and EMI compliance, designers should follow proper PCB layout and design practices, such as using shielding, grounding, and filtering techniques. TI provides guidelines and resources for EMC and EMI compliance in the THS3201 datasheet and application notes.
  • TI recommends using a combination of ceramic and electrolytic capacitors for power supply decoupling and filtering. The THS3201 datasheet provides guidelines for power supply filtering and decoupling, and the evaluation module documentation includes a recommended power supply filter design.

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THS3201MDGNREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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