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THS4211DGN - Texas Instruments

Description: Ultra-Low-Distortion, High-Speed Operational Amplifier with Shutdown

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THS4211DGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D
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THS4211DGN - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D
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THS4211DGN Details

  • Manufacturer Part Number:

    THS4211DGN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    20 µA

  • Bandwidth (3dB)-Nom:

    35 MHz

  • Bias Current-Max (IIB) @25C:

    15 µA

  • Common-mode Reject Ratio-Min:

    52 dB

  • Common-mode Reject Ratio-Nom:

    56 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    6 µA

  • Input Offset Voltage-Max:

    12000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8.25 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    YES

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.07 mm

  • Slew Rate-Nom:

    970 V/us

  • Supply Current-Max:

    22 mA

  • Supply Voltage Limit-Max:

    8.25 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000000

  • Voltage Gain-Min:

    1412.5

  • Wideband:

    YES

  • Width:

    3 mm

THS4211DGN Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the THS4211DGN evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The choice of input and output capacitors depends on the specific application and frequency range. TI recommends using low-ESR capacitors with a value of 10uF to 22uF for input and output decoupling. The datasheet provides more information on capacitor selection.
  • The THS4211DGN is rated for operation from -40°C to 125°C. However, the device's performance may degrade at extreme temperatures, and the user should consult the datasheet for more information on temperature-related specifications.
  • The THS4211DGN is a commercial-grade device, but TI offers a radiation-hardened version, the THS4211RHGN, which is designed for high-reliability and aerospace applications. The user should consult TI's radiation-hardened product portfolio for more information.
  • TI provides a troubleshooting guide in the THS4211DGN datasheet, which covers common issues and their solutions. Additionally, the user can consult TI's application notes and technical articles for more information on troubleshooting and design optimization.

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THS4211DGN Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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