SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Power:
NO
Programmable Power:
NO
Qualification Status:
Not Qualified
Seated Height-Max:
1.45 mm
Slew Rate-Min:
975 V/us
Slew Rate-Nom:
990 V/us
Subcategory:
Operational Amplifier
Supply Current-Max:
18 mA
Supply Voltage Limit-Max:
8.25 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Technology:
BICMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.95 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Unity Gain BW-Nom:
230000
Voltage Gain-Min:
10000
Wideband:
YES
Width:
1.6 mm
THS4221DBVR Frequently Asked Questions (FAQs)
A good PCB layout for the THS4221DBVR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
The input capacitor should be a low-ESR ceramic capacitor with a value between 10nF to 100nF. The output capacitor should be a low-ESR ceramic capacitor with a value between 100nF to 1uF. The capacitor values and types may need to be adjusted based on the specific application and operating frequency.
The maximum power dissipation of the THS4221DBVR is 1.4W. However, the actual power dissipation will depend on the operating conditions, such as the input voltage, output current, and ambient temperature. It is recommended to calculate the power dissipation based on the specific application and ensure that the device is properly heat-sinked.
To ensure stability, it is recommended to follow the recommended PCB layout, use the recommended input and output capacitors, and ensure that the device is properly decoupled. Additionally, the device should be operated within the recommended operating conditions, and the output should not be overloaded.
The THS4221DBVR is rated for operation up to 125°C. However, the device's performance and reliability may be affected at high temperatures. It is recommended to derate the device's power dissipation and output current at high temperatures, and to ensure that the device is properly heat-sinked.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
THS4221DBVR Overview
Use the download button to access the THS4221DBVR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like THS42,
or try a keyword search, such as Operational Amplifiers
About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
