SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Packing Method:
TUBE
Peak Reflow Temperature (Cel):
260
Power:
NO
Programmable Power:
NO
Qualification Status:
Not Qualified
Seated Height-Max:
1.07 mm
Slew Rate-Nom:
2800 V/us
Subcategory:
Operational Amplifier
Supply Current-Max:
28 mA
Supply Voltage Limit-Max:
8.25 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Technology:
BICMOS
Temperature Grade:
COMMERCIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Unity Gain BW-Nom:
300000
Voltage Gain-Min:
355
Wideband:
YES
Width:
3 mm
THS4501CDGN Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout in the THS4501CDGN evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
The input termination resistors depend on the specific application and signal source. TI provides a termination resistor calculator tool to help select the correct values based on the signal frequency, amplitude, and source impedance.
The THS4501CDGN is specified to operate from -40°C to 125°C, but it's essential to consider the derating of the device's performance and reliability at extreme temperatures. Consult the datasheet and application notes for more information.
Yes, the THS4501CDGN can be used in a non-inverting amplifier configuration. However, it's crucial to ensure that the input common-mode voltage range is within the specified limits, and the output voltage swing is not exceeded.
To minimize EMI, follow proper PCB layout and design practices, such as using a solid ground plane, minimizing signal trace lengths, and using shielding or filtering components. TI also provides EMI reduction guidelines in the THS4501CDGN application notes.
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THS4501CDGN Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
