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THS4503CDGNR - Texas Instruments

Description: High-Speed Fully-Differential Amplifiers

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THS4503CDGNR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D
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THS4503CDGNR - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D
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THS4503CDGNR Details

  • Manufacturer Part Number:

    THS4503CDGNR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    5 µA

  • Bandwidth (3dB)-Nom:

    30 MHz

  • Bias Current-Max (IIB) @25C:

    4.6 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    2 µA

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8.25 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.07 mm

  • Slew Rate-Nom:

    2800 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    28 mA

  • Supply Voltage Limit-Max:

    8.25 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    300000

  • Voltage Gain-Min:

    355

  • Wideband:

    YES

  • Width:

    3 mm

THS4503CDGNR Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS4503CDGNR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended PCB layout, use a low-ESR output capacitor, and add a series resistor (Rs) in the feedback path. Additionally, the gain and phase margins should be checked to ensure they meet the stability criteria.
  • The maximum power dissipation of the THS4503CDGNR is dependent on the ambient temperature and the thermal resistance of the package. The power dissipation can be calculated using the formula: Pd = (Vcc x Icc) + (Vout x Iout). The maximum power dissipation is typically around 2.5W.
  • The THS4503CDGNR is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the thermal management and heat dissipation in the system design to ensure reliable operation.
  • To filter out noise and EMI, it's recommended to use a pi-filter (L-C-R) at the input, add a ferrite bead in series with the input, and use a shielded cable for the input signal. Additionally, a common-mode choke can be used to filter out common-mode noise.

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THS4503CDGNR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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