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THS4509QRGTRQ1 - Texas Instruments

Description: WIDEBAND LOW-NOISE LOW-DISTORTION FULLY DIFFERENTIAL AMPLIFIER

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PCB Footprints
THS4509QRGTRQ1 - Texas Instruments PCB footprint - Other - Other - QFN50P300X300X100-17N
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3D Models
THS4509QRGTRQ1 - Texas Instruments  - 3D model - Other - QFN50P300X300X100-17N
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THS4509QRGTRQ1 Details

  • Manufacturer Part Number:

    THS4509QRGTRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    6000000 µA

  • Bandwidth (3dB)-Nom:

    275 MHz

  • Bias Current-Max (IIB) @25C:

    18.5 µA

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    NO

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -3 V

  • Neg Supply Voltage-Nom (Vsup):

    -1.5 V

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Slew Rate-Nom:

    6600 V/us

  • Supply Current-Max:

    37 mA

  • Supply Voltage Limit-Max:

    3 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000000

  • Wideband:

    YES

  • Width:

    3 mm

THS4509QRGTRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS4509 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The choice of gain resistors depends on the desired gain and bandwidth of the amplifier. A higher gain resistor value will result in higher gain but may compromise bandwidth. TI provides a gain resistor calculator tool to help with the selection.
  • The maximum power dissipation of the THS4509 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this can be derated based on the operating temperature and thermal resistance.
  • Yes, the THS4509 can be used as a single-ended amplifier by tying the negative input to ground and using the positive input as the signal input. However, this will result in a reduced gain and bandwidth compared to differential operation.
  • The THS4509 has a built-in low-pass filter that can be used to filter out high-frequency noise. Additionally, external filters such as RC filters or ferrite beads can be used to further reduce noise. It's also important to ensure good PCB layout and decoupling to minimize noise coupling.

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THS4509QRGTRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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