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THS4513RGTT - Texas Instruments

Description: 1.6-GHz, Min Gain 1V/V, Low-Noise, Low Distrortion Fully Differential Amplifier

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THS4513RGTT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - THS4513RGTT
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THS4513RGTT - Texas Instruments  - 3D model - Quad Flat No-Lead - THS4513RGTT
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THS4513RGTT Details

  • Manufacturer Part Number:

    THS4513RGTT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    18.5 µA

  • Bandwidth (3dB)-Nom:

    1300 MHz

  • Bias Current-Max (IIB) @25C:

    15.5 µA

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    3.6 µA

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -3 V

  • Neg Supply Voltage-Nom (Vsup):

    -2.5 V

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Slew Rate-Nom:

    5100 V/us

  • Supply Current-Max:

    37 mA

  • Supply Voltage Limit-Max:

    3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2800000

  • Wideband:

    YES

  • Width:

    3 mm

THS4513RGTT Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS4513RGTT involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended PCB layout, use a low-ESR output capacitor, and add a series resistor (Rs) in the feedback path. Additionally, the gain and phase margins should be checked to ensure they meet the stability criteria.
  • The maximum power dissipation of the THS4513RGTT is dependent on the ambient temperature and the thermal resistance of the package. The power dissipation can be calculated using the formula: Pd = (Vcc x Icc) + (Vout x Iout). The maximum power dissipation is typically around 1.4W.
  • The output capacitor should be chosen based on the desired output impedance, stability, and ripple rejection. A low-ESR capacitor with a value between 10uF to 100uF is recommended. The capacitor should also be rated for the maximum output voltage and current.
  • The recommended input impedance for the THS4513RGTT is around 1kΩ to 10kΩ. A higher input impedance can lead to reduced bandwidth and increased noise, while a lower input impedance can cause instability and oscillations.

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THS4513RGTT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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