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TIC12400QDCPRQ1 - Texas Instruments

Description: Interface - Specialized Automotive 35-V multi-switch detection interface (MSDI) with SPI & integrated ADC 38-HTSSOP -40 to 125

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TIC12400QDCPRQ1 Details

  • Manufacturer Part Number:

    TIC12400QDCPRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2017-09-10

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDSO-G38

  • JESD-609 Code:

    e4

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP38,.25,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TIC12400QDCPRQ1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The thermal pad should be connected to a large copper area to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended operating conditions, including voltage, current, and temperature. Also, follow proper PCB design and layout guidelines to minimize thermal resistance and ensure reliable operation.
  • Critical timing parameters include the input rise and fall times, output delay, and clock frequency. Ensure that these parameters are met by following the recommended operating conditions and using a suitable clock source. Also, use a buffer or repeater if the clock signal is weak or has a long propagation delay.
  • Follow the recommended power sequencing guidelines to ensure that the device is powered up and down correctly. Use a power sequencer or a dedicated power management IC to control the power supply voltage and ensure that the device is properly powered down when not in use.
  • The TIC12400QDCPRQ1 has built-in ESD protection, but it's still important to follow proper ESD handling and storage procedures to prevent damage. For latch-up prevention, ensure that the device is operated within the recommended operating conditions and that the power supply voltage is well-regulated.

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TIC12400QDCPRQ1 Overview

Use the download button to access the TIC12400QDCPRQ1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TIC12, or try a keyword search, such as Other Interface ICs

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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