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TIP112TU - onsemi

Description: NPN Epitaxial Silicon Darlington Transistor

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TIP112TU - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TIP112TU..
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TIP112TU Details

  • Manufacturer Part Number:

    TIP112TU

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220-3

  • Package Description:

    TO-220, 3 PIN

  • Manufacturer Package Code:

    340AT

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Collector Current-Max (IC):

    2 A

  • Collector-Emitter Voltage-Max:

    100 V

  • Configuration:

    DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

  • DC Current Gain-Min (hFE):

    500

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    50 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Element Material:

    SILICON

TIP112TU Frequently Asked Questions (FAQs)

  • The maximum SOA for the TIP112TU is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. A safe operating area can be assumed to be around 10A and 60V.
  • To ensure linear operation, the TIP112TU should be biased in the active region, which is typically between 1-5V on the base with respect to the emitter. The collector-emitter voltage should be around 2-5V, and the collector current should be limited to the recommended maximum value.
  • The recommended heatsink for the TIP112TU depends on the specific application and power dissipation requirements. However, a general rule of thumb is to use a heatsink with a thermal resistance of around 10-20°C/W to ensure the device operates within its recommended temperature range.
  • While the TIP112TU is primarily designed for linear applications, it can be used in switching applications with some caution. However, the device's switching characteristics, such as rise and fall times, may not be optimized for high-frequency switching. Additional circuitry, such as snubbers or gate resistors, may be required to ensure reliable operation.
  • To protect the TIP112TU from ESD, it is recommended to handle the device with anti-static wrist straps, mats, or other ESD protection equipment. Additionally, the device should be stored in anti-static packaging and handled in a controlled environment to minimize the risk of ESD damage.

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TIP112TU Overview

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