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TISP4070H3BJR-S - Bourns

Description: 58V Off-State 300 A Ipp TVS Thyristor DO-214AA, SMB

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TISP4070H3BJR-S - Bourns - PCB symbol
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TISP4070H3BJR-S - Bourns PCB footprint - Other - Other - TISP4070H3BJR-S-6
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TISP4070H3BJR-S - Bourns - 3D model - Other - TISP4070H3BJR-S-6
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TISP4070H3BJR-S Details

  • Manufacturer Part Number:

    TISP4070H3BJR-S

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    SMBJ, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    UK

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6

  • Breakover Voltage-Max:

    70 V

  • Configuration:

    SINGLE

  • DC Off-state Voltage-Max:

    58 V

  • Holding Current-Max:

    600 mA

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-Repetitive Pk On-state Cur:

    60 A

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    THYRISTOR SURGE PROTECTOR

TISP4070H3BJR-S Frequently Asked Questions (FAQs)

  • A good PCB layout for the TISP4070H3BJR-S should minimize lead lengths, use a solid ground plane, and keep the device away from high-frequency noise sources. A 4-layer PCB with a dedicated ground plane is recommended.
  • Use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Ensure the device is properly aligned and secured to the PCB before soldering.
  • The TISP4070H3BJR-S can operate safely between -40°C to 125°C, but the device's performance may degrade above 85°C. Ensure proper thermal management to maintain optimal performance.
  • Yes, the TISP4070H3BJR-S is designed to withstand vibrations up to 10g, but ensure the device is properly secured to the PCB and the PCB is securely fastened to the system to prevent damage.
  • Use a multimeter to check for proper voltage supply, verify the device is properly soldered, and check for any signs of physical damage. Consult the datasheet and application notes for troubleshooting guides.

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TISP4070H3BJR-S Overview

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