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TISP4350H3BJR-S - Bourns

Description: 275V Off-State 300 A Ipp TVS Thyristor DO-214AA, SMB

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TISP4350H3BJR-S - Bourns - PCB symbol
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PCB Footprints
TISP4350H3BJR-S - Bourns PCB footprint - Other - Other - SMB
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3D Models
TISP4350H3BJR-S - Bourns - 3D model - Other - SMB
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TISP4350H3BJR-S Details

  • Manufacturer Part Number:

    TISP4350H3BJR-S

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    SMBJ, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    UK

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6

  • Breakover Voltage-Max:

    350 V

  • Configuration:

    SINGLE

  • DC Off-state Voltage-Max:

    275 V

  • Holding Current-Max:

    600 mA

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-Repetitive Pk On-state Cur:

    60 A

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    THYRISTOR SURGE PROTECTOR

TISP4350H3BJR-S Frequently Asked Questions (FAQs)

  • A good PCB layout for the TISP4350H3BJR-S should minimize lead lengths, use a solid ground plane, and keep the device away from high-frequency noise sources. A 4-layer PCB with a dedicated ground plane is recommended.
  • Use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the device.
  • The TISP4350H3BJR-S can operate safely between -40°C and 125°C, but the device's performance may degrade at extreme temperatures. Ensure proper thermal management to maintain optimal performance.
  • Yes, the TISP4350H3BJR-S is designed for high-reliability applications. However, it's essential to follow Bourns' recommended design and testing guidelines to ensure the device meets the specific requirements of your application.
  • Start by verifying the device is properly soldered and the PCB layout is correct. Check for signs of overheating, electrical overstress, or physical damage. Consult the datasheet and application notes for troubleshooting guidance.

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TISP4350H3BJR-S Overview

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TISP4350H3BJR-S Alternates

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Part Image TISP4350H3BJ-S Bourns Inc

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Part Image TISP4350H3BJ Bourns Inc

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For a full list of alternate parts for TISP4350H3BJR-S, check out Findchips.com