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TJA1057GTK/3 - NXP

Description: High-speed CAN transceiver

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PCB Footprints
TJA1057GTK/3 - NXP PCB footprint - Small Outline No-lead - Small Outline No-lead - SOT782-1
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3D Models
TJA1057GTK/3 - NXP  - 3D model - Small Outline No-lead - SOT782-1
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TJA1057GTK/3 Details

  • Manufacturer Part Number:

    TJA1057GTK/3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVSON-8

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    6.92

  • Data Rate:

    5000 Mbps

  • JESD-30 Code:

    S-PDSO-N8

  • Length:

    3 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    70 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    CAN FD TRANSCEIVER

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

TJA1057GTK/3 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11535, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The TJA1057GTK/3 can be configured for different bus speeds using the SPLIT pin. By connecting the SPLIT pin to VCC or GND, you can select between 10 Mbps, 100 Mbps, or 1000 Mbps operation. Refer to the datasheet for specific configuration details.
  • The maximum cable length supported by the TJA1057GTK/3 depends on the bus speed and cable characteristics. As a general guideline, NXP recommends a maximum cable length of 100 meters for 10 Mbps, 50 meters for 100 Mbps, and 20 meters for 1000 Mbps operation.
  • To ensure EMC, follow the guidelines in the NXP application note AN11535, which provides recommendations for PCB layout, component selection, and shielding. Additionally, ensure that the system design meets the relevant EMC standards, such as IEC 61000-4-2 and IEC 61000-4-3.
  • The power consumption of the TJA1057GTK/3 depends on the operating mode and bus speed. According to the datasheet, the typical power consumption is around 150 mA for 10 Mbps, 250 mA for 100 Mbps, and 350 mA for 1000 Mbps operation.

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TJA1057GTK/3 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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