TJA1124AHG/0Z footprint, schematic symbol and 3D model by NXP

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PCB Footprints

TJA1124AHG/0Z - NXP PCB footprint - Other - Other - DHVQFN24 (SOT815-1)_2

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Datasheet Download Datasheet
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Part Number TJA1124AHG/0Z
Manufacturer NXP
Pin Count 25
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - DHVQFN24 (SOT815-1)_2
Released Date Feb 14, 2020
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

TJA1124AHG/0Z Details

Manufacturer Part Number:
TJA1124AHG/0Z
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Package Description:
DHVQFN-24
Country Of Origin:
Thailand
HTS Code:
8542.39.00.01
Manufacturer:
NXP Semiconductors
YTEOL:
0
JESD-30 Code:
R-PQCC-N24
JESD-609 Code:
e4
Length:
5.5 mm
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Terminals:
24
Number of Transceivers:
4
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
HVQCCN
Package Equivalence Code:
LCC24,.12X16,20
Package Shape:
RECTANGULAR
Package Style:
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel):
260
Screening Level:
AEC-Q100
Seated Height-Max:
1 mm
Supply Current-Max:
87 mA
Supply Voltage-Nom:
12 V
Surface Mount:
YES
Telecom IC Type:
LIN TRANSCEIVER
Terminal Finish:
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form:
NO LEAD
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
3.5 mm

TJA1124AHG/0Z Frequently Asked Questions (FAQs)

A good PCB layout for the TJA1124AHG/0Z involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces connected to the high-frequency pins. A 4-layer PCB with a dedicated ground plane is recommended.
To ensure reliable communication, use a reliable communication protocol such as SPI or UART, and implement error-checking mechanisms such as checksums or CRC. Also, ensure that the microcontroller and the TJA1124AHG/0Z are properly synchronized and that the baud rate is set correctly.
The TJA1124AHG/0Z has a maximum junction temperature of 150°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid operating the device at maximum power for extended periods. Also, follow the recommended PCB layout guidelines to minimize thermal resistance.
To troubleshoot issues with the TJA1124AHG/0Z, use a logic analyzer or oscilloscope to monitor the signals, check the power supply and ground connections, and verify that the device is properly configured and initialized. Also, consult the datasheet and application notes for troubleshooting guidelines.
The TJA1124AHG/0Z is rated for operation from -40°C to 125°C, but it's recommended to derate the device for high-temperature operation. For high-humidity environments, ensure that the device is properly sealed and conformally coated to prevent moisture ingress. Consult the datasheet and application notes for specific guidelines.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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