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TJA1466CHG/0J - NXP

Description: Plastic thermal enhanced very thin small outline package; no leads; 18 terminals; body 3mm × 4.5mm × 0.85mm , 400µA , 60mA ,-36V ~ +40V , -40°C ~ +150°C

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Symbol
TJA1466CHG/0J - NXP - PCB symbol
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PCB Footprints
TJA1466CHG/0J - NXP PCB footprint - Other - Other - SOT2163-1_Master
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3D Models
TJA1466CHG/0J - NXP - 3D model - Other - SOT2163-1_Master
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TJA1466CHG/0J Details

  • Manufacturer Part Number:

    TJA1466CHG/0J

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    14

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Telecom IC Type:

    CAN TRANSCEIVER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Time@Peak Reflow Temperature-Max (s):

    40

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TJA1466CHG/0J Overview

Use the download button to access the TJA1466CHG/0J schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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