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TJF1052IT/5Y - NXP

Description: CAN Interface IC Galvanically isolated high-speed CAN transceiver

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TJF1052IT/5Y - NXP - PCB symbol
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PCB Footprints
TJF1052IT/5Y - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SO16 (SOT162-1)
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3D Models
TJF1052IT/5Y - NXP - 3D model - Small Outline Packages - SO16 (SOT162-1)
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TJF1052IT/5Y Details

  • Manufacturer Part Number:

    TJF1052IT/5Y

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOP

  • Package Description:

    SOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    SOT162-1

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • Data Rate:

    5000 Mbps

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    70 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

TJF1052IT/5Y Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Monitor the device's junction temperature, ensure the supply voltage is within the recommended range, and provide adequate heat sinking to prevent overheating.
  • Critical timing parameters include clock frequency, setup and hold times, and propagation delay. Ensure these parameters are met by following the recommended clocking scheme, using a stable clock source, and verifying signal integrity.
  • Use a shielded enclosure, ensure proper grounding, and follow good PCB layout practices to minimize EMI. Implement EMI filters and shielding on I/O lines, and ensure the device is operated within its recommended frequency range.
  • Use a logic analyzer or oscilloscope to verify signal integrity and timing. Perform functional testing, such as input/output verification, and use a thermal camera to monitor junction temperature.

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TJF1052IT/5Y Overview

Use the download button to access the TJF1052IT/5Y schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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