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TK33S10N1Z - Toshiba

Description: N-ch MOSFET, 100 V, 33 A, 0.0097 Ω@10V, DPAK+

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TK33S10N1Z - Toshiba PCB footprint - Other - Other - 2-7M1A
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TK33S10N1Z - Toshiba  - 3D model - Other - 2-7M1A
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TK33S10N1Z Details

  • Manufacturer Part Number:

    TK33S10N1Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    32 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    66.5 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    33 A

  • Drain-source On Resistance-Max:

    0.0097 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    140 pF

  • JESD-30 Code:

    R-PSSO-G2

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    125 W

  • Pulsed Drain Current-Max (IDM):

    99 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TK33S10N1Z Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
  • Implement a heat sink or thermal management system, and ensure the device is operated within the recommended temperature range (TJ = -40°C to 150°C).
  • The maximum allowed voltage for the gate-source (VGS) is ±20V, and for the gate-drain (VGD) is ±15V.
  • Yes, the TK33S10N1Z is suitable for high-frequency switching applications up to 100 kHz, but ensure proper PCB layout and decoupling to minimize ringing and EMI.
  • The internal diode's reverse recovery time (trr) is approximately 200 ns. To minimize the impact of trr, use a snubber circuit or a fast-recovery diode in parallel with the MOSFET.

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