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TK3R2E06PL,S1X - Toshiba

Description: MOSFET X35 Pb-F POWER MOSFET TRANSISTOR TO-220AB(OS) PD=168W F=1MHZ

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TK3R2E06PL,S1X - Toshiba - PCB symbol
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PCB Footprints
TK3R2E06PL,S1X - Toshiba PCB footprint - Other - Other - 2-10X1A
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3D Models
TK3R2E06PL,S1X - Toshiba - 3D model - Other - 2-10X1A
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TK3R2E06PL,S1X Details

  • Manufacturer Part Number:

    TK3R2E06PL,S1X

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-220, 3 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    5.1

  • Avalanche Energy Rating (Eas):

    61 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    100 A

  • Drain-source On Resistance-Max:

    0.0032 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    55 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    168 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TK3R2E06PL,S1X Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves, ensure proper heat sinking, and consider using a thermal interface material (TIM) to reduce thermal resistance.
  • Toshiba recommends soldering at a peak temperature of 260°C (500°F) for 10 seconds or less, with a soldering iron temperature of 350°C (662°F) or less. A solder with a melting point of 217°C (423°F) or higher is recommended.
  • Yes, the TK3R2E06PL,S1X is qualified for automotive and high-reliability applications. However, it's essential to follow the recommended qualification process and ensure compliance with relevant industry standards, such as AEC-Q101.
  • Toshiba recommends following standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the components in an ESD-protected environment. The component itself has an ESD rating of 2kV human body model (HBM) and 150V machine model (MM).

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TK3R2E06PL,S1X Overview

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