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TL082CPT - STMicroelectronics

Description: General purpose JFET dual operational amplifiers

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TL082CPT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-8
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TL082CPT Details

  • Manufacturer Part Number:

    TL082CPT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, TSSOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    4.15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.02 µA

  • Bias Current-Max (IIB) @25C:

    0.0004 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    86 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0001 µA

  • Input Offset Voltage-Max:

    13000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.4 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    8

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Min:

    8 V/us

  • Slew Rate-Nom:

    16 V/us

  • Supply Current-Max:

    5 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    4000

  • Voltage Gain-Min:

    15000

  • Wideband:

    NO

  • Width:

    3 mm

TL082CPT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TL082CPT is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (RthJA) of 125°C/W.
  • To ensure stability in a unity-gain buffer configuration, it's recommended to add a capacitor (typically 10-100pF) between the output and the inverting input to compensate for the op-amp's internal capacitance and prevent oscillations.
  • For optimal performance, it's recommended to use a symmetrical layout, keep the input and output traces short and away from noise sources, and use a solid ground plane to reduce electromagnetic interference (EMI).
  • The TL082CPT is rated for operation up to 125°C, but its performance may degrade at higher temperatures. If you need to operate in high-temperature environments, consider using a more temperature-resistant op-amp or taking additional thermal management measures.
  • To prevent electrostatic discharge (ESD) damage, use ESD-protective equipment, such as wrist straps and mats, when handling the TL082CPT. You can also add external ESD protection devices, like TVS diodes, to the circuit.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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