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TLC2262AIDRG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps Advanced LinCMOS Rail-To-Rail Dual

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TLC2262AIDRG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLC2262AIDRG4 - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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TLC2262AIDRG4 Details

  • Manufacturer Part Number:

    TLC2262AIDRG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Country Of Origin:

    Mexico, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0008 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    88 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0008 µA

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.25 V/us

  • Slew Rate-Nom:

    0.55 V/us

  • Supply Current-Max:

    0.5 mA

  • Supply Voltage Limit-Max:

    8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    730

  • Voltage Gain-Min:

    50000

  • Wideband:

    NO

  • Width:

    3.9 mm

TLC2262AIDRG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended layout and routing guide in their application note SLVAE03, which includes guidelines for PCB layout, component placement, and routing to minimize noise and ensure optimal performance.
  • The TLC2262AIDRG4 has a specific power-up and power-down sequencing requirement to prevent latch-up and ensure proper operation. The recommended sequence is to power up VCC before VIN, and power down VIN before VCC. Additionally, the enable pin (EN) should be tied to VCC or VIN, and not left floating.
  • The TLC2262AIDRG4 can drive capacitive loads up to 1000 pF, but it's recommended to limit the load capacitance to 100 pF or less to ensure stability and prevent oscillations.
  • To reduce noise and EMI, use a low-ESR capacitor for decoupling, keep the PCB layout compact, and use a ground plane to reduce radiation. Additionally, consider using a ferrite bead or a common-mode choke to filter the output.
  • The TLC2262AIDRG4 has a thermal derating of 13.3 mW/°C above 25°C, which means that the maximum power dissipation decreases as the temperature increases. Ensure that the device is properly heat-sinked and that the operating temperature is within the recommended range.

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TLC2262AIDRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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