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TLC2274ACDG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps Advanced LinCMOS Rail-To-Rail Quad

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TLC2274ACDG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (-R-PDSO-G14)
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TLC2274ACDG4 - Texas Instruments  - 3D model - Small Outline Packages - D (-R-PDSO-G14)
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TLC2274ACDG4 Details

  • Manufacturer Part Number:

    TLC2274ACDG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Mainland China, Malaysia, Mexico, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    1989-03-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    75 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    950 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1.7 V/us

  • Slew Rate-Nom:

    3.6 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    6 mA

  • Supply Voltage Limit-Max:

    8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2180

  • Voltage Gain-Min:

    25000

  • Wideband:

    NO

  • Width:

    3.9 mm

TLC2274ACDG4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends following a star-grounding scheme, keeping analog and digital grounds separate, and using a solid ground plane to minimize noise. Additionally, keep the input and output traces short and away from each other to reduce crosstalk.
  • TI recommends powering up the VCC pin before the VIN pin, and powering down the VIN pin before the VCC pin. This ensures that the internal circuitry is properly initialized and avoids latch-up or damage.
  • The TLC2274ACDG4 can drive up to 1nF of capacitive load. However, excessive capacitive loading can cause instability and oscillation. TI recommends using a series resistor to isolate the capacitive load and ensure stability.
  • When the input common-mode voltage exceeds the specified range, the TLC2274ACDG4 may exhibit reduced linearity, increased distortion, or even latch-up. TI recommends ensuring that the input common-mode voltage remains within the specified range to maintain optimal performance.
  • The recommended operating temperature range for the TLC2274ACDG4 is -40°C to 125°C. Temperature affects the amplifier's offset voltage, gain, and bandwidth. TI recommends consulting the datasheet for detailed temperature-related specifications and ensuring proper thermal management to maintain optimal performance.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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