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TLC2274AIDRG4 - Texas Instruments

Description: OP Amp Quad GP R-R O/P ±8V/16V 14-Pin SOIC T/R

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TLC2274AIDRG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (-R-PDSO-G14)
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TLC2274AIDRG4 - Texas Instruments  - 3D model - Small Outline Packages - D (-R-PDSO-G14)
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TLC2274AIDRG4 Details

  • Manufacturer Part Number:

    TLC2274AIDRG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-14

  • Pin Count:

    14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0008 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1.7 V/us

  • Slew Rate-Nom:

    3.6 V/us

  • Supply Current-Max:

    6 mA

  • Supply Voltage Limit-Max:

    8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2250

  • Voltage Gain-Min:

    25000

  • Wideband:

    NO

  • Width:

    3.9 mm

TLC2274AIDRG4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends following a star-grounding topology, keeping analog and digital grounds separate, and using a solid ground plane to minimize noise. Additionally, keep the input and output traces short and away from each other to reduce capacitive coupling.
  • TI recommends powering up the VCC pin before the VIN pin, and powering down the VIN pin before the VCC pin. This ensures that the internal circuitry is properly initialized and prevents latch-up or damage.
  • The TLC2274AIDRG4 can drive up to 100pF of capacitive load. However, excessive capacitive loading can cause instability and oscillation. TI recommends using a series resistor to isolate the capacitive load and ensure stability.
  • The gain and bandwidth of the TLC2274AIDRG4 can be optimized by selecting the appropriate gain-setting resistors and capacitors. TI provides a gain-bandwidth calculator tool to help designers optimize their amplifier configuration for specific applications.
  • The TLC2274AIDRG4 is rated for operation from -40°C to 125°C. Operating the amplifier outside this range can affect its performance, including gain, bandwidth, and noise. TI recommends derating the amplifier's performance at extreme temperatures.

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TLC2274AIDRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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