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TLC2274AIPWRG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps Advanced LinCMOS Rail-To-Rail Quad

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TLC2274AIPWRG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW (R-PDSO-G14)
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TLC2274AIPWRG4 Details

  • Manufacturer Part Number:

    TLC2274AIPWRG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Pin Count:

    14

  • Country Of Origin:

    Mainland China, Malaysia, Mexico, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    1989-03-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0008 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    75 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    950 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Min:

    1.7 V/us

  • Slew Rate-Nom:

    3.6 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    6 mA

  • Supply Voltage Limit-Max:

    8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2180

  • Voltage Gain-Min:

    15000

  • Wideband:

    NO

  • Width:

    4.4 mm

TLC2274AIPWRG4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with short traces, and placing the device close to the power supply bypass capacitors to minimize noise and ensure stability. A 4-layer PCB with a solid ground plane is also recommended.
  • The TLC2274AIPWRG4 has a thermal pad that must be connected to a thermal relief pattern on the PCB to dissipate heat. A thermal via array or a copper pour with multiple vias can be used to connect the thermal pad to the thermal relief pattern.
  • Texas Instruments recommends using a 10uF to 22uF ceramic capacitor for input decoupling and a 10uF to 47uF ceramic capacitor for output decoupling. The capacitor values may vary depending on the specific application and operating conditions.
  • To ensure stability, the TLC2274AIPWRG4 requires a minimum of 10nF to 22nF of capacitance between the output and the inverting input. Additionally, the device should be operated within the recommended operating conditions, and the PCB layout should be designed to minimize noise and parasitic inductance.
  • The TLC2274AIPWRG4 has an operating temperature range of -40°C to 125°C. However, the device may not meet its specified performance characteristics at the extreme temperatures, and derating may be necessary for high-temperature applications.

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TLC2274AIPWRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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