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TLC2274CDR - Texas Instruments

Description: Texas Instruments TLC2274CDR, Quad Op Amp, 2.18MHz CMOS, Rail to Rail, 5 → 15 V, 14-Pin SOIC

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TLC2274CDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (-R-PDSO-G14)
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TLC2274CDR - Texas Instruments  - 3D model - Small Outline Packages - D (-R-PDSO-G14)
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TLC2274CDR Details

  • Manufacturer Part Number:

    TLC2274CDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Malaysia, Mexico, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    1989-03-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    75 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -16 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUT LINE

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1.7 V/us

  • Slew Rate-Nom:

    3.6 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    6 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2180

  • Voltage Gain-Min:

    25000

  • Wideband:

    NO

  • Width:

    3.9 mm

TLC2274CDR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of TLC2274CDR is 670mW, which is calculated based on the package thermal resistance and the maximum junction temperature.
  • To ensure stability in the TLC2274CDR op-amp, it is recommended to use a capacitor with a value of 10nF to 100nF between the output and the inverting input, and to avoid capacitive loads greater than 100pF.
  • For optimal performance, it is recommended to use a star-grounding technique, where the grounds of the power supplies, analog circuits, and digital circuits are connected at a single point. Additionally, keep the input and output traces short and away from noise sources.
  • While TLC2274CDR can be used as a comparator, it is not recommended due to its limited slew rate and bandwidth. Instead, consider using a dedicated comparator like the LM339 or TLC3702.
  • To reduce noise and EMI, use a low-pass filter at the input, keep the circuit layout compact, and use shielding or a metal enclosure to reduce electromagnetic radiation. Additionally, consider using a ferrite bead or common-mode choke to filter out high-frequency noise.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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