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TLC2274MD - Texas Instruments

Description: Texas Instruments TLC2274MD, Dual CMOS Op Amp, 2.18MHz Rail-Rail, 4.4 → 16 V, 14-Pin SOIC

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TLC2274MD - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (-R-PDSO-G14)
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TLC2274MD - Texas Instruments  - 3D model - Small Outline Packages - D (-R-PDSO-G14)
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TLC2274MD Details

  • Manufacturer Part Number:

    TLC2274MD

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, MS-012AB, SOIC-14

  • Pin Count:

    14

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    1989-03-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0008 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    75 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1.7 V/us

  • Slew Rate-Nom:

    3.6 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    6 mA

  • Supply Voltage Limit-Max:

    8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2180

  • Voltage Gain-Min:

    20000

  • Wideband:

    NO

  • Width:

    3.9 mm

TLC2274MD Frequently Asked Questions (FAQs)

  • The maximum power dissipation of TLC2274MD is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and thermal resistance (RθJA) of 125°C/W.
  • To ensure stability in the TLC2274MD op-amp, it's essential to follow proper PCB layout practices, such as minimizing parasitic capacitance and inductance, using a low-ESR capacitor for decoupling, and avoiding high-gain configurations.
  • While TLC2274MD is an op-amp, it can be used as a comparator in certain applications. However, it's essential to note that the device is not optimized for comparator operation and may not provide the same level of performance as a dedicated comparator.
  • The input impedance of TLC2274MD is typically around 10^12 ohms, which is relatively high. This makes it suitable for applications where high input impedance is required, such as in audio circuits or sensor interfaces.
  • To handle ESD protection for TLC2274MD, it's recommended to use a TVS (Transient Voltage Suppressor) diode or an ESD protection device at the input pins. Additionally, following proper PCB layout practices and using a ground plane can help reduce the risk of ESD damage.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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