SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH
Screening Level:
AEC-Q100
Seated Height-Max:
1.7 mm
Supply Current-Max:
1.9 mA
Supply Voltage-Max:
40 V
Supply Voltage-Min:
5.5 V
Supply Voltage-Nom:
13.5 V
Surface Mount:
YES
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Width:
3.9 mm
TLD1124EL Frequently Asked Questions (FAQs)
Infineon recommends a PCB layout with a large copper area connected to the exposed pad (EP) of the TLD1124EL to ensure good thermal conductivity. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a solid ground plane to reduce thermal resistance.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using a thermal interface material (TIM) between the device and the heat sink, and ensure the heat sink is properly attached to the device. Operating the device within the recommended temperature range and providing adequate cooling will also help prevent thermal-related issues.
Although the datasheet doesn't specify a maximum voltage for the enable pin (EN), it's recommended to keep the voltage within the range of 0 V to VCC (5 V) to ensure proper operation and prevent damage to the device.
The TLD1124EL is designed for low-dropout voltage regulation and is not intended for high-current applications. If you need to support high currents, consider using a different device or adding external components to ensure the device can handle the required current.
To troubleshoot issues with the TLD1124EL, start by verifying the input voltage, output voltage, and enable pin (EN) voltage. Check for proper PCB layout, thermal design, and component selection. Use an oscilloscope to monitor the output voltage and input voltage ripple. If issues persist, consult the datasheet and application notes or contact Infineon's technical support for further assistance.
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TLD1124EL Overview
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