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TLD1314ELXUMA1 - Infineon

Description: Infineon TLD1314ELXUMA1 LED Driver IC, 5.5 → 40 V 120mA 14-Pin SSOP

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TLD1314ELXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 14-Pin SSOP
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3D Models
TLD1314ELXUMA1 - Infineon  - 3D model - Small Outline Packages - 14-Pin SSOP
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TLD1314ELXUMA1 Details

  • Manufacturer Part Number:

    TLD1314ELXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-14

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7.89

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    9

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSSOP

  • Package Equivalence Code:

    SSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.7 mm

  • Supply Current-Max:

    1.9 mA

  • Supply Voltage-Max:

    40 V

  • Supply Voltage-Min:

    5.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

TLD1314ELXUMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Infineon recommends following the thermal design guidelines, using a heat sink if necessary, and ensuring good airflow around the device. Additionally, consider using a thermistor or thermocouple to monitor the temperature and adjust the system design accordingly.
  • Infineon recommends a peak reflow temperature of 260°C, with a soldering time of 30-60 seconds. The device is compatible with lead-free soldering processes.
  • Infineon recommends storing the devices in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the devices by the body, not the leads.
  • Infineon recommends following standard ESD protection procedures, such as using an ESD wrist strap or mat, and handling the devices in a static-protected environment.

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TLD1314ELXUMA1 Overview

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