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TLD5098ELXUMA1 - Infineon

Description: LED Lighting Drivers Infineon Power LED Driver

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TLD5098ELXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-SSOP-14
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TLD5098ELXUMA1 - Infineon  - 3D model - Small Outline Packages - PG-SSOP-14
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TLD5098ELXUMA1 Details

  • Manufacturer Part Number:

    TLD5098ELXUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SSOP

  • Package Description:

    GREEN, PLASTIC, SSOP-14

  • Pin Count:

    14

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    8

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Max:

    45 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    13.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

  • fmax-Min:

    0.5 MHz

TLD5098ELXUMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to ensure good thermal conductivity. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
  • To ensure EMC, Infineon recommends using a shielded cable for the output stage, keeping the PCB layout as compact as possible, and using a common mode choke or ferrite bead to filter the output current.
  • The maximum allowed voltage drop across the device is 0.5 V. Exceeding this voltage drop may lead to reduced efficiency and increased heat generation.
  • Infineon recommends using an overcurrent protection (OCP) circuit and an overtemperature protection (OTP) circuit to prevent damage to the device. The OCP should be set to 1.5 times the maximum output current, and the OTP should be set to 150°C.
  • Infineon recommends using a low-ESR ceramic capacitor with a value of 10 μF to 22 μF, depending on the input voltage and output current requirements.

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