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TLE2425MD - Texas Instruments

Description: Precision Virtual Ground

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TLE2425MD - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A_HEIGHT 1.75
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TLE2425MD - Texas Instruments  - 3D model - Small Outline Packages - D0008A_HEIGHT 1.75
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TLE2425MD Details

  • Manufacturer Part Number:

    TLE2425MD

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    INPUT VOLTAGE RANGE IS 4V TO 40V

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.08 A

  • Output Voltage-Max:

    2.52 V

  • Output Voltage-Min:

    2.48 V

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    40 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.8%

  • Width:

    3.9 mm

TLE2425MD Frequently Asked Questions (FAQs)

  • The TLE2425MD is a high-frequency device, so it's essential to follow good layout practices to minimize noise and ensure proper operation. TI recommends placing the device close to the power supply, using short traces, and avoiding vias under the device. A solid ground plane and decoupling capacitors are also crucial.
  • The TLE2425MD can deliver up to 1A of current, which requires careful consideration of PCB trace width, thermal management, and component selection. Ensure that your PCB traces are wide enough to handle the current, and consider using thermal vias or heat sinks to dissipate heat. Choose components with suitable current ratings and thermal characteristics.
  • The TLE2425MD's output voltage regulation is affected by the input voltage. The device has a built-in voltage regulator that maintains a stable output voltage (VCC) despite input voltage variations. However, the input voltage range (2.7V to 10V) affects the output voltage regulation. For optimal performance, ensure that the input voltage is within the recommended range.
  • To ensure EMC, follow good design practices such as using a solid ground plane, decoupling capacitors, and shielding. Place the TLE2425MD away from noise-sensitive components, and use ferrite beads or common-mode chokes to filter out high-frequency noise. Additionally, consider using a metal shield or enclosure to contain electromagnetic radiation.
  • The TLE2425MD has a maximum junction temperature (TJ) of 150°C. Ensure that your design provides adequate thermal management, such as heat sinks, thermal vias, or thermal pads, to keep the device within its operating temperature range. Also, consider the thermal resistance of the PCB and surrounding components.

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TLE2425MD Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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