Infineon provides a recommended PCB layout in the application note AN2015-01, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
The thermal shutdown feature is designed to protect the device from overheating. When the junction temperature exceeds 170°C, the device will shut down. To handle this, ensure proper thermal design, use a heat sink if necessary, and implement a thermal monitoring and shutdown strategy in your system design.
The recommended input capacitor value is 10uF to 22uF, and the type should be a low-ESR ceramic capacitor (e.g., X5R or X7R) to ensure stable operation and minimize voltage ripple.
Follow the guidelines in the Infineon application note AN2015-01 for PCB layout, component selection, and shielding to minimize EMI. Additionally, ensure that your system design meets the relevant EMC standards and regulations.
The maximum allowed voltage drop is 1.5V. Exceeding this value may affect the device's performance and reliability. Ensure that your system design takes into account the voltage drop and provides a sufficient voltage supply.
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