Please enter a minimum 3 letters or numbers
Technical Content
Part Image

TLE7250XLEXUMA1 - Infineon

Description: INFINEON - TLE7250XLEXUMA1 - CAN TRANSCEIVER, 2MBPS, TSON-8

Download TLE7250XLEXUMA1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
TLE7250XLEXUMA1 - Infineon - PCB symbol
click to zoom
PCB Footprints
TLE7250XLEXUMA1 - Infineon PCB footprint - Small Outline No-lead - Small Outline No-lead - PG-TSON-8
click to zoom
3D Models
TLE7250XLEXUMA1 - Infineon - 3D model - Small Outline No-lead - PG-TSON-8
click to zoom

TLE7250XLEXUMA1 Details

  • Manufacturer Part Number:

    TLE7250XLEXUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TSON-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Data Rate:

    2000 Mbps

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSON

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.15 mm

  • Supply Current-Max:

    60 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    CAN FD TRANSCEIVER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

TLE7250XLEXUMA1 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal via array can help to dissipate heat efficiently.
  • To ensure EMC, follow proper PCB design and layout guidelines, use a shielded enclosure, and ensure that the device is properly decoupled. Additionally, use filters or chokes to reduce electromagnetic interference (EMI) and ensure that the device is operated within its specified frequency range.
  • Use a 4-wire Kelvin connection method for accurate voltage and current measurements. Ensure that the measurement equipment is properly calibrated and that the device is operated within its specified temperature range. Use a logic analyzer or an oscilloscope to measure the device's output signals.
  • Use a voltage regulator or a voltage supervisor to ensure that the device operates within its specified voltage range. Implement overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage to the device. Use a voltage monitor or a reset IC to detect and respond to voltage faults.
  • Ensure good thermal conductivity between the device and the PCB, and use a heat sink or a thermal pad to dissipate heat. Operate the device within its specified temperature range, and avoid overheating or thermal runaway conditions. Use thermal simulation tools to analyze and optimize the thermal performance of the device.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TLE7250XLEXUMA1 Overview

Use the download button to access the TLE7250XLEXUMA1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TLE72, or try a keyword search, such as Network Interfaces

Parts related to TLE7250XLEXUMA1

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑

TLE7250XLEXUMA1 Alternates

Showing results

Image Part Number Model
Part Image IFX1051LE Infineon Technologies AG

1-Trnsvr, PDSO8
Part Image IFX1051LEXUMA1 Infineon Technologies AG

Interface Circuit, PDSO8