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TLE75008ESDXUMA1 - Infineon

Description: Power Switch ICs - Power Distribution SPIDER

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TLE75008ESDXUMA1 Details

  • Manufacturer Part Number:

    TLE75008ESDXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSDSO-24

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7.05

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    8

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    0.33 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.15 mm

  • Supply Current-Max:

    4.2 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    7 V

  • Supply Voltage-Nom:

    13.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    35 µs

  • Turn-on Time:

    35 µs

  • Width:

    3.9 mm

TLE75008ESDXUMA1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the power source, and the input and output tracks should be kept short and wide to minimize inductance and resistance.
  • The device should be mounted on a heat sink or a metal pad on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Ensure good airflow around the device and avoid blocking the airflow with other components.
  • The maximum allowed voltage drop across the device is 0.5V. Exceeding this value may affect the device's performance and reliability.
  • The device is rated for operation up to 150°C. However, the maximum junction temperature (TJ) should not exceed 150°C. Ensure proper cooling and thermal management to prevent overheating.
  • Use a logic analyzer or oscilloscope to monitor the input and output signals. Check the power supply voltage, input signal integrity, and output load conditions. Consult the datasheet and application notes for troubleshooting guidelines.

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