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TLE75602EMDXUMA1 - Infineon

Description: Power Switch Hi Side/Lo Side 8-OUT 0.26A 1Ohm Automotive 24-Pin SSOP EP T/R

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TLE75602EMDXUMA1 - Infineon - PCB symbol
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PCB Footprints
TLE75602EMDXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-TSDSO-24
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3D Models
TLE75602EMDXUMA1 - Infineon - 3D model - Small Outline Packages - PG-TSDSO-24
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TLE75602EMDXUMA1 Details

  • Manufacturer Part Number:

    TLE75602EMDXUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SSOP-24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G24

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSSOP

  • Package Equivalence Code:

    SSOP24,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    18 V

  • Supply Voltage1-Min:

    7 V

  • Supply Voltage1-Nom:

    13.5 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    35 µs

  • Turn-on Time:

    35 µs

  • Width:

    3.9 mm

TLE75602EMDXUMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a PCB layout with a large copper area connected to the exposed pad (EP) of the device to improve thermal dissipation. A minimum of 2oz copper thickness and a thermal via array under the EP are recommended.
  • The input capacitor should be selected based on the input voltage ripple requirement, output current, and PCB layout. A minimum capacitance of 10uF with a voltage rating of 25V or higher is recommended. X5R or X7R ceramic capacitors are suitable options.
  • The maximum allowed voltage on the EN pin is 6V. Applying a voltage higher than 6V may damage the device.
  • The TLE75602EMDXUMA1 requires a controlled power-up and power-down sequence to prevent damage. The EN pin should be pulled high after the input voltage has reached its nominal value, and pulled low before the input voltage drops below its minimum rating.
  • The recommended operating temperature range for the TLE75602EMDXUMA1 is -40°C to 150°C. Operating the device outside this range may affect its performance and reliability.

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TLE75602EMDXUMA1 Overview

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